Method and system for forming a silicon ingot using a low-grade silicon feedstock

ABSTRACT

Techniques for the formation of a silicon ingot using a low-grade silicon feedstock include forming within a crucible device a molten silicon from a low-grade silicon feedstock and performing a directional solidification of the molten silicon to form a silicon ingot within the crucible device. The directional solidification forms a generally solidified quantity of silicon and a generally molten quantity of silicon. The method and system include removing from the crucible device at least a portion of the generally molten quantity of silicon while retaining within the crucible device the generally solidified quantity of silicon. Controlling the directional solidification of the generally solidified quantity of silicon, while removing the more contaminated molten silicon, results in a silicon ingot possessing a generally higher grade of silicon than the low-grade silicon feedstock.

FIELD

The present disclosure relates to methods and systems for use in thefabrication of semiconductor materials such as silicon. Moreparticularly, the present disclosure relates to a method and system forforming a higher purity semiconductor ingot using low puritysemiconductor feedstock.

DESCRIPTION OF THE RELATED ART

The photovoltaic industry (PV) industry is growing rapidly and isresponsible for an increasing amount of silicon being consumed beyondthe more traditional uses as integrated circuit (IC) applications.Today, the silicon needs of the solar cell industry are starting tocompete with the silicon needs of the IC industry. With presentmanufacturing technologies, both integrated circuit (IC) and solar cellindustries require a refined, purified, silicon feedstock as a startingmaterial.

Materials alternatives for solar cells range from single-crystal,electronic-grade (EG) silicon to relatively dirty, metallurgical-grade(MG) silicon. EG silicon yields solar cells having efficiencies close tothe theoretical limit (but at a prohibitive price), while MG silicontypically fails to produce working solar cells. Early solar cells madefrom polycrystalline silicon achieved relatively low efficiencies near6%. Efficiency is a measure of the fraction of the energy incident uponthe cell to that collected and converted into electric current. However,there may be other semiconductor materials that could be useful forsolar cell fabrication.

Cells commercially available today at 24% efficiencies are made possibleby higher purity materials and improved processing techniques. Theseengineering advances have helped the industry approach the theoreticallimit for single junction silicon solar cell efficiencies of 31%. Inpractice nearly 90% of commercial solar cells are made of crystallinesilicon.

Several factors determine the quality of raw silicon material that maybe useful for solar cell fabrication. These factors may include, forexample, transition metal and dopant content and distribution.Transition metals pose a principal challenge to the efficiency ofmulticrystalline silicon solar cells. Multicrystalline silicon solarcells may tolerate transition metals such as iron (Fe), copper (Cu), ornickel (Ni) in concentrations up to 10¹⁶ cm⁻³, because metals inmulticrystalline silicon are often found in less electrically activeinclusions or precipitates, often located at structural defects (e.g.,grain boundaries) rather than being atomically dissolved.

Low-grade feedstock materials for the PV industry, such as upgradedmetallurgical (UMG) silicon, are typically processed into ingots andwafers of multi-crystalline (mc) Si with correspondingly low quality.This low quality is controlled by a high concentration of impuritiesthat ultimately degrade solar cell characteristics. Degradation can beparticularly severe if impurities interact with structural defectscharacteristic of mc-Si. In this respect, one of the most harmfuldefects are intra-granular dislocations which are mainly introduced atuncontrolled stress relief in the cooling phase of crystallization.

Non-metallic impurities including carbon (C) and dopants (mostly B andP) are extracted using a variety of cleaning technologies, such asblowing reactive gases through molten Si. Typically, a combination ofseveral cleaning steps/technologies is applied to reach an acceptablequality level of mc-Si after crystallization. Since cost adds up withadding cleaning steps there is the desire to use as low-quality materialas possible. As a result, there are feedstock materials that oftencontain very high amounts of C or/and P. If the concentration of Cexceeds solubility at crystallization, silicon carbide (SiC)precipitates form in respective crystals/ingots and SiC degrades heavilyrespective mc-Si materials.

Metallic impurities are heavily enriched towards the end ofcrystallization. If directional solidification starts at the bottom of aSi melt, as in the case of e.g. Bridgman casting, the solidifying mc-Sibecomes badly contaminated at the top of respective ingots. Since mostof the quality-degrading metals in Si are relatively fast diffusers incrystalline Si, those metals can partially diffuse back into thesolidified Si during ingot cooling, leading to additional degradation ofdeeper parts of respective ingots. This makes it impossible to useextended ramp-down for in-situ ingot annealing, at least in thetemperature range beyond approx. 1050° C. (where metals diffusion isespecially fast). On the other hand, this temperature range ispotentially useful for in-situ annealing to improve the crystallinestructure and reduce frozen-in stress in mc-Si ingots.

If the process continues through to the complete solidification of thesilicon melt, then the metal impurities diffuse back into the siliconingot. Without the diffusion, the silicon ingot would be of a higherpurity. The result of such back diffusion becomes a quantity of siliconin the ingot that is not usable, but which would have been usable hadthe back diffusion not occurred. Presently, no known process adequatelyaddresses this problem.

Accordingly, a need exists for a source of silicon ingots to meet thesilicon needs of the solar cell industry, which source may not competewith the demands of the IC industry.

A need exists for providing silicon ingots that may ultimately formcommercially available solar cells with efficiencies presentlyachievable using expensive higher purity materials and/or costlyprocessing techniques.

A further need exists for a process capable of yielding a higher qualitysilicon ingot using a low-grade silicon feedstock achieving a generalcost reduction. Still a need exists for a method and system that botheconomically and effectively addresses the problem of impurity backdiffusion in the final stages of silicon ingot formation.

SUMMARY

Techniques are here disclosed for formation of a silicon ingot which maybe useful for ultimately making solar cells. The present disclosureincludes a method and system for, and a resulting silicon ingotincluding higher purity semiconductor material using lower puritysemiconductor feedstock. For example, using silicon ingots formed fromthe processes here disclosed, solar wafers and solar cells with improvedperformance/cost ratio are practical. In addition, the presentdisclosure may readily and efficiently combine with metal-related defectremoval and modification processes at the wafer level to yield a highlyefficient PV solar cell.

According to one aspect of the disclosed subject matter, a semiconductoringot forming method and associated system are provided for using alow-grade silicon feedstock that includes forming within a crucibledevice a molten silicon from a low-grade silicon feedstock. The processand system perform a directional solidification of the molten silicon toform a silicon ingot within the crucible device. The directionalsolidification forms a generally solidified quantity of silicon and agenerally molten quantity of silicon. The method and system includeremoving from the crucible device at least a portion of the generallymolten quantity of silicon while retaining within the crucible devicethe generally solidified quantity of silicon. The process and systemfurther control the directional solidification of the generallysolidified quantity of silicon to form a silicon ingot possessing agenerally higher grade of silicon than the low-grade silicon feedstock.A variety of pathways for removing the more contaminated molten siliconare here disclosed.

These and other advantages of the disclosed subject matter, as well asadditional novel features, will be apparent from the descriptionprovided herein. The intent of this summary is not to be a comprehensivedescription of the claimed subject matter, but rather to provide a shortoverview of some of the subject matter's functionality. Other systems,methods, features and advantages here provided will become apparent toone with skill in the art upon examination of the following FIGUREs anddetailed description. It is intended that all such additional systems,methods, features and advantages be included within this description, bewithin the scope of the accompanying claims.

BRIEF DESCRIPTIONS OF THE DRAWINGS

The features, nature, and advantages of the disclosed subject matter maybecome more apparent from the detailed description set forth below whentaken in conjunction with the drawings in which like referencecharacters identify correspondingly throughout and wherein:

FIG. 1 is a prior art flow diagram depicting generally the knownprocesses for forming a solar cell;

FIG. 2, in contrast, shows generally an overall solar cell formationprocess that may incorporate the teachings of the disclosed subjectmatter;

FIG. 3 illustrates one embodiment of a process environment in which toachieve the results of the present disclosure;

FIG. 4 shows a process flow according to the present disclosure for ahigher purity silicon ingot from a low-grade silicon feedstock;

FIGS. 5 and 6 present an embodiment a molten silicon removal process asdisclosed by the present subject matter;

FIGS. 7 and 8 illustrate various forms of molten siliconpre-conditioning as may be application to the present disclosure;

FIGS. 9 through 11 an alternative embodiment silicon removal processapplicable to the present disclosure;

FIGS. 12 and 13 exhibit a further alternative embodiment silicon removalprocess within the scope of the present disclosure; and

FIGS. 14 and 15 provide different aspects of a crucible device that mayfind application within the subject matter of the present disclosure.

DETAILED DESCRIPTION OF THE SPECIFIC EMBODIMENTS

The method and system of the present disclosure provide a semiconductoringot formation process for producing a higher purity silicon orsemiconductor ingot using a low purity or high impurity silicon orsemiconductor feedstock. The presently disclosed process saves onemelting process by combining previously separately performed processingsteps, as well as making better use of the inherent cooling phase in thesilicon ingot formation process. The present disclosure includes apathway for removing molten silicon to leave the silicon ingot while theingot formation takes place. The molten silicon that the disclosedsubject matter removes generally possesses a larger amount of impuritiesthan the silicon ingot being formed.

Removing the more contaminated silicon melt avoids back-contamination bymetal impurities into the already formed silicon ingot. Without theconcern for back-diffusion of such impurities, even further siliconingot process control and improvements are possible. For example, thereis the possibility to hold an ingot at an elevated temperature to avoidthe stresses that would otherwise exist in a system not capable ofavoiding the back diffusion of metal impurities. Along with stressreduction goes reduced stress-related formation of structural defects inrespective ingots, leading to further enhancement of ingot quality.

The ultimate advantage is reduction of total cost since lower-gradefeedstock can be used for directional solidification of a silicon ingot.Ingots made by the presently disclosed process and system are of higherquality as compared to ingots produced by known directionalsolidification techniques using lower purity feedstock. Among varioustechnical advantages and achievements herein described, certain ones ofparticular note include the ability to reduce the amount of metallic andnon-metallic impurities present in a semiconductor ingot such as may beuseful in solar cell fabrication. Another specific advantage isavoidance of high-concentration regions of non-metals, mainly B, P andC, in top regions of ingots made from UMG-Si feedstock materials.

Laying a context for the present disclosure, FIG. 1 depicts a knownprocess 10 beginning at step 12. At step 12, MG or other low-gradesilicon enters known wafer forming process flow 10. Known process flow10 extracts high-grade silicon from MG silicon at step 14. High-gradesilicon extraction step 14 is a high-cost processing sequence resultingin EG silicon. This is the type of silicon feedstock material used formaking the ingot in step 16. Known process flow 10 includes slicing thesilicon ingot, generally using a wire-saw to derive a silicon wafer atstep 18. The resulting silicon wafers then enter solar cell formationprocess 20.

FIG. 2 depicts, in general terms, novel aspects of a solar cell formingprocess flow 30 wherein the present disclosure exhibits particularadvantages. Process flow 30 includes using MG silicon at steps 32 thatis purified to some degree to become BMG or UMG silicon. The siliconquality reached is still a low-grade silicon 34. Accordingly, siliconquality 36 relates to much lower cost as compared to silicon quality 14.Also, low-grade silicon at step 36 possesses a higher content ofmetallic and other impurities as compared to silicon quality 14. At step38, silicon ingot formation may occur. Step 40 represents the formationof silicon wafers, i.e., slicing from the silicon ingot. The disclosedsolar cell forming process flow 30 may introduce a wafer treatment step40, also called pre-process step, before starting the cell process.Finally, the solar cell forming process occurs at step 42.

At steps 34 and 36 of process flow 30, the teachings of the disclosedsubject matter affect the formation of a silicon ingot. For the purposeof specifying a process environment in which to apply the teachings ofthe present disclosure, FIG. 3 illustrates process environment 50. InFIG. 3, crucible 52 contains silicon melt 54. Heating zones 58 surroundthe sides and bottom of crucible 42. Isolation chamber 60 furtherestablishes a process environment in conjunction with crucible 52 fortemperature control and to establish a process atmosphere. Water coolingsystem 62 surrounds isolation chamber 60, which camera 64 may penetrateto allow observation of silicon melt 52.

Process environment 50 has a height 66, which crucible 54 spansvertically. However, for enhanced process control dropping mechanism 68,which has a radius 70 may move vertically downward within lower frame 72to expose different portions of crucible 54 to different temperatureheating zones 58 more rapidly or at in more varying ways that can directheating zone control. Processing environment 50 provides a sealed growthchamber having a vacuum of, for example, below 1×10⁻³ Torr and cyclepurged with argon to 10 psig several times to expel any oxygen remainingin the chamber. Heating zones 58 may be heated by a multi-turn inductioncoil in a parallel circuit with a tuning capacitor bank.

FIG. 4 presents an exemplary flowchart 80 for the presently disclosedsilicon ingot formation process. Beginning at step 82, silicon ingotforming process 80 loads a crucible, such as crucible 54 or the variouscrucible embodiments disclosed below, with low-grade silicon feedstock.At step 84 molten silicon forms from the low-grade silicon feedstock byvirtue of a heating process. Once a discernable amount of silicon meltforms in the crucible, a determination of whether the silicon melt formsbelow a predetermined pathway for its removal occurs at step 86. If so,a next test 88 determines whether there is the need to add morelow-grade silicon feedstock to the crucible.

In essence, this determination is to assure that, as the directionalsolidification of the silicon melt 52 forms a higher grade siliconingot, the progressively contaminated silicon melt ultimately has a pathfor its removal in the molten state. By removing contaminated siliconmelt 52 while in the molten state, it is possible to prevent theback-diffusion of the contaminants into the higher purity silicon ingot,as will be described in more detail below.

Now, once a sufficient amount of low-grade silicon feedstock, and,therefore, silicon melt 52 exists within crucible 54, an optionalprocess or set of processes preconditioning silicon melt 52 may Occur.Such preconditioning steps may include one or a combination of the stepsfor extracting impurities deriving from the low-grade silicon.

The various silicon melt preconditioning steps may include a gas bubblenucleation step 90, an ultrasonic energy agitation step 92, or acombination of such steps or further steps including electromagneticenergy transfer to the melt, such as ellipsis 94 depicts. Moreover, asarrow 96 suggests, such steps may be bypassed. As step 98 further shows,such preconditioning may include a step of including various additivesto silicon melt 52.

Next, the process of the present disclosure includes initiation ofdirectional solidification of silicon melt 52 to begin silicon ingotformation, at step 100. As the directional solidification of the meltforms the silicon ingot, a phase transformation of the silicon fromliquid to solid occurs. Due to the phase transformation, expansion ofthe silicon volume within crucible 54 occurs, increasing the level ofnow combined molten and solidified silicon, as step 102 depicts. As thesilicon level within the crucible continues to increase, a separation ofthe molten silicon takes place. This separation occurs due to thephysical characteristics of one or more embodiments of crucible 52 asshown and described in greater detail below.

With the separation of molten silicon from crystallized silicon, as step104 indicates, the silicon that remains in crucible 52 is of a higherpurity than the silicon feedstock from which the silicon melt forms. Theextraction of the silicon melt takes with it a higher concentration ofimpurities. The result is, in essence, the elimination or substantialreduction in the likelihood that impurities from the silicon melt 52will back diffuse into the silicon ingot.

Because of the reduced likelihood of impurity back diffusion, step 106may occur. At step 106, ingot formation process 80 reducescrystallization stresses that arise within a silicon ingot during morerapid cooling processes. A lower concern for impurity back diffusionduring a slower cooling process, allows for controlling the rate ofcrystallized silicon cooling so as to relieve crystallization stresses.The reduced crystallization stress in the resulting silicon ingot yetfurther yields a higher purity silicon ingot, as step 108 shows.

FIGS. 5 and 6 show in more detail aspects of step 102 of process flow80, wherein volumetric expansion of silicon in the solid orcrystallizing form facilitates the removal of the increasinglycontaminated silicon melt. In FIG. 5 appears process state 110, whichincludes a crucible 112 that provides a pathway for the silicon meltremoval. Crucible 112 contains in process volume 114 both silicon ingotportion 116 and silicon melt 118. Interface 120 separates silicon ingotportion 116 from silicon melt 118. Crucible 112 further containsinterstitial wall 122 separating process volume 114 from silicon meltflow volume 124.

FIG. 6 shows the progressive raising of interface 120 at state 130 ofsilicon ingot formation process 80. Thus, as the volumetric expansion ofthe solidified silicon 116 occurs, both the rising level of interface120 and the increasing contamination of silicon melt 118 takes place.The effect is raise silicon melt at and above the lower height ofinterstitial wall 122. That is, the lower height of interstitial wall122 forms a pathway 132 for the removal of silicon melt 118. As will beshown below, pathway 132 may be formed in numerous ways. However, theembodiment of FIGS. 5 and 6 show one desirable, yet ingeniously simpleway to cause the removal of silicon melt 118 from the ingot formationprocess volume 114 of crucible 112.

To make more clear how the presently disclosed process may preconditionsilicon melt 118, FIGS. 7 and 8 show, respectively, the use of bubblenucleation and the combination of bubble nucleation and ultrasonicenergy agitation for the purpose of facilitating the extraction ofimpurities during the early stages of directional siliconsolidification. Referring, therefore, to FIG. 7, process state 140,wherein gas tubes 142 may be inserted into silicon melt 118. Siliconmelt 118 may receive through gas tubes certain amounts of gases such asoxygen, nitrogen, hydrogen, water vapor, CO₂ or Chlorine-containinggases such as HCl or combinations of the above gases and other gases.These gases react with impurities dissolved in the silicon melt 118 andform volatile compounds which evaporate from the melt. This can resultin a more pure silicon ingot portion 116 (FIG. 5) during subsequentdirectional solidification step 100 of silicon ingot formation process80.

FIG. 8 shows in state 150 one embodiment of a silicon melt 118preconditioning step 92, wherein an ultrasonic energy source 152 mayconnect with gas tubes 142. That is, gas tube 142 may not only serve asa conduit for delivery of nucleation bubbles 114, but may also serve asan ultrasonic energy path for transmitting energy from ultrasonic energysource 152 into silicon melt 118. Here, too, the preconditioning ofsilicon melt 118 promotes a more pure resulting silicon melt portion 116by extracting impurities deriving from the low-grade silicon.

FIGS. 9 through 11 expand the concept of a pathway for the removal ofthe contaminated silicon melt. In particular, FIG. 9 shows that, inconjunction with a crucible, such as crucible 54, there may be a siliconingot portion 116 and a silicon melt 118 with interface 120. Since, ashas been explained, with the growth of silicon ingot portion 116,impurities have concentrated in silicon melt 118. The embodiment of FIG.9 demonstrates one path for removing the contaminated silicon melt 188.

FIGS. 9 through 11 shows process stage 130 in which porous felt device132 provides a material that demonstrates a significantly higher meltingtemperature than that of silicon melt 118. By lowering porous feltdevice 112 into silicon melt 118, absorption of silicon melt 118 occurs.FIG. 10, therefore, demonstrates in process stage 134 that porous feltdevice 132 has absorbed a significant portion, if not all of siliconmelt 118, thereby permitting the removal of contaminated silicon melt118 from crucible 54. FIG. 11 shows in process stage 136 the removal ofporous felt device 122 from crucible 54, taking with it contaminatedsilicon melt 118.

FIGS. 12 and 13 depict a further embodiment of the present disclosurewherein the pathway for removal of silicon melt 118 includes a movableflow valve device. In particular, FIG. 12 depicts a process state 140for a crucible 142 embodiment that includes a two-part flow valveassembly 144. Flow-valve assembly 144 includes valve stem 146, whichpenetrates through crucible outer aperture 148 and inner aperture 150 ofinterstitial wall 152. When inserted through both outer aperture 148 andinner aperture 150, valve stem 146 maintains an empty silicon melt 118flow volume 154.

As silicon ingot portion 116 forms, silicon melt 118 develops withincrucible process volume 152 above both interface 120 and inner aperture150. Once silicon ingot portion reaches approximately the level of inneraperture 150, valve stem 146 may be withdrawn through inner aperture150.

FIG. 13 shows in process state 160 that by withdrawing valve stem 146from inner aperture 150, while maintain valve stem 146 within outeraperture 148 a pathway for silicon melt 118 to flow into flow volume154. The flow of silicon melt 118 through the pathway of inner aperture150 and into flow volume 154 removes from process volume 152 thecontaminated silicon melt 118, thereby preventing a significant degreeof back diffusion of contaminants in a subsequent processing steps.

Now, there may be various embodiments of one or more crucibles thatprovide the pathway such as described in the above FIGUREs. Thus, inaddition to the above-described crucibles, FIGS. 15 and 16 demonstrateyet a further embodiment of a crucible device 170 that is suitable forachieving the purposes of the present disclosure. In particular,crucible device 170 may include process volume 172 for receiving alow-grade silicon feedstock and producing there from silicon ingotportion. Inner wall 174 may surround process volume 172. Flow volume 176surrounds inner wall 174, and outer wall 178 surrounds flow volume 176.

FIG. 16 further depicts crucible device 170 to include flow-valveassembly 144 having, as described above, valve stem 146, whichpenetrates through flow volume outer aperture 180 of outer wall 178 andprocess environment 172 inner aperture 182. Operation flow-valveassembly 144 is as described above, with the distinction that with flowvolume 176 surrounding inner wall 174, withdrawal of valve stem 146causes silicon melt 118 to surround inner well 174.

In summary, the disclosed subject matter provides a method and systemfor forming a silicon ingot which includes forming within a crucibledevice a molten silicon from a low-grade silicon feedstock andperforming a directional solidification of the molten silicon to form asilicon ingot within the crucible device. The directional solidificationforms a generally solidified quantity of silicon and a generally moltenquantity of silicon. The method and system include removing from thecrucible device at least a portion of the generally molten quantity ofsilicon while retaining within the crucible device the generallysolidified quantity of silicon. Controlling the directionalsolidification of the generally solidified quantity of silicon forms asilicon ingot possessing a generally higher grade of silicon than thelow-grade silicon feedstock. Such control may include extending theduration of the directional solidification of the generally solidifiedquantity of silicon for reducing material stresses arising from thecrystallization of the silicon ingot.

The method and system may pre-condition the molten silicon forextracting impurities deriving from the low-grade silicon, such as byintroducing bubble nucleation into the molten silicon, transmittingultrasonic energy or electromagnetic energy into the molten silicon andcombining with the molten silicon an additive for aiding in theextraction of the impurities from the molten silicon.

Various embodiments of the present disclosure include removing from thecrucible device at least a portion of the generally molten quantity ofsilicon by flowing the generally molten quantity of silicon via apathway associated with the crucible device. Embodiments of the pathwaymay include a lower interstitial wall separating a first volume of thecrucible device from a second volume of the crucible device, the firstvolume of the crucible device containing the generally solidifiedquantity of silicon and the generally molten quantity of silicon. Insuch embodiment, the lower interstitial wall further having a heightapproximating a height of a predetermined interface level between thegenerally solidified quantity of silicon and the generally moltenquantity of silicon at a predetermined point during the directionalsolidification. The lower interstitial wall permits at least a portionof the generally molten quantity of silicon to flow from the firstvolume of the crucible device to the second volume of the crucibledevice, thereby separating the portion of the generally molten quantityof silicon from the generally solidified quantity of silicon.

Another embodiment flows a portion of the generally molten quantity ofsilicon into the second volume surrounding the first volume. Anotherpathway may include a felt device for absorbing the generally moltenquantity of silicon that may be submersed into the generally moltenquantity of silicon. The molten silicon is absorbed into the felt deviceand removed to take with it the absorbed portion of the generally moltensilicon. The pathway comprises a drain conduit and a plug deviceassociated to control flow of the generally molten quantity of siliconthrough the drain conduit and further comprising the step ofcontrollably positioning the plug device for controlling flow of thegenerally molten quantity of silicon from the crucible device. Themethod disassociates the generally molten quantity of silicon from thegenerally solidified quantity of silicon.

Still another embodiment of the present disclosure provides a drainconduit separating a first volume of the crucible device from a secondvolume of the crucible device. A plug device associates to control flowof the generally molten quantity of silicon through the drain conduit.The process further controllably positions the plug device forcontrolling flow of molten silicon from the first volume to the secondvolume for disassociating the molten silicon from silicon. The secondvolume may surround the first volume.

As a result of using the presently disclosed subject matter, animprovement in the properties of low-grade semiconductor materials, suchas upgraded metallurgical-grade silicon (UMG) occurs. Such improvementallows use of UMG silicon, for example, in producing solar cells as maybe used in solar power generation and related uses. The method andsystem of the present disclosure, moreover, particularly benefits theformation of semiconductor solar cells using UMG or other non-electronicgrade semiconductor materials. The present disclosure may allow theformation of solar cells in greater quantities and in a greater numberof fabrication facilities than has heretofore been possible.

The process and system features and functions described herein,therefore, form a higher purity silicon ingot from lower purity siliconfeedstock. Although various embodiments which incorporate the teachingsof the present disclosure have been shown and described in detailherein, those skilled in the art may readily devise many other variedembodiments that still incorporate these teachings. The foregoingdescription of the preferred embodiments, therefore, is provided toenable any person skilled in the art to make or use the claimed subjectmatter. Various modifications to these embodiments will be readilyapparent to those skilled in the art, and the generic principles definedherein may be applied to other embodiments without the use of theinnovative faculty. Thus, the claimed subject matter is not intended tobe limited to the embodiments shown herein, but is to be accorded thewidest scope consistent with the principles and novel features disclosedherein.

1.-15. (canceled)
 16. A system for forming a silicon ingot using alow-grade silicon feedstock, said silicon ingot comprising higher gradesilicon than said low-grade silicon feedstock, comprising: a crucibledevice for receiving and heating a low-grade silicon feedstock, saidlow-grade silicon feedstock for forming a molten silicon in response tosaid heating; temperature control means for performing a directionalsolidification of said molten silicon to form a silicon ingot withinsaid crucible device, said directional solidification forming agenerally solidified quantity of silicon and a generally molten quantityof silicon; a removal mechanism for removing from said crucible deviceat least a portion of said generally molten quantity of silicon whileretaining within said crucible device said generally solidified quantityof silicon; and said temperature control mechanism further forcontrolling said directional solidification of said generally solidifiedquantity of silicon to form a silicon ingot possessing a generallyhigher grade of silicon than said low-grade silicon feedstock.
 17. Thesystem of claim 16, further comprising means for pre-conditioning saidmolten silicon for extracting impurities deriving from said low-gradesilicon.
 18. The system of claim 16, further comprising a bubblenucleation source associated with said crucible device forpre-conditioning said molten silicon by introducing bubble nucleationinto said molten silicon.
 19. The system of claim 16, a bubblenucleation source for introducing gas bubble nucleation into said moltensilicon using gases from the group consisting essentially of oxygen,nitrogen, hydrogen, water vapor, carbon dioxide and chlorine-containinggases)
 20. The system of claim 20, further comprising an ultrasonicenergy source associated with crucible device for transmitting anultrasonic energy into said molten silicon for enhancing the extractionof impurities from said molten silicon.
 21. The system of claim 21,wherein said step of pre-conditioning said molten silicon furthercomprises the step of combining with said molten silicon an additive foraiding in the extraction of said impurities from said molten silicon.22. The system of claim 16, wherein said temperature control mechanismfurther comprises means for extending the duration of said directionalsolidification of said generally solidified quantity of silicon forreducing material stresses arising from the crystallization of saidsilicon ingot.
 23. The system of claim 16, further comprising a pathwayassociated with said crucible device for removing from said crucibledevice said at least a portion of said generally molten quantity ofsilicon by flowing said generally molten quantity of silicon via saidpathway.
 24. The system of claim 23, wherein said pathway comprises alower interstitial wall separating a first volume of said crucibledevice from a second volume of said crucible device, said first volumeof said crucible device containing said generally solidified quantity ofsilicon and said generally molten quantity of silicon; said lowerinterstitial wall further having a height approximating a height of apredetermined interface level between said generally solidified quantityof silicon and said generally molten quantity of silicon at apredetermined point during said directional solidification; and saidlower interstitial wall permitting at least a portion of said generallymolten quantity of silicon to flow from said first volume of saidcrucible device to said second volume of said crucible device, therebyseparating said portion of said generally molten quantity of siliconfrom said generally solidified quantity of silicon.
 25. The system ofclaim 23, wherein said second volume surrounds said first volume forflowing said at least a portion of said generally molten quantity ofsilicon into said second volume surrounding said first volume.
 26. Thesystem of claim 23, said pathway comprising: a felt device for absorbingat least a portion of said generally molten quantity of silicon forsubmersing said felt device into said generally molten quantity ofsilicon; and means for removing said felt device including said absorbedportion of said generally molten quantity of silicon from said crucibledevice.
 27. The system of claim 16, wherein said pathway comprises adrain conduit and a plug device associated to control flow of saidgenerally molten quantity of silicon through said drain conduit forcontrollably positioning said plug device, thereby controlling flow ofsaid generally molten quantity of silicon from said crucible device anddisassociating at least a portion of said generally molten quantity ofsilicon from said generally solidified quantity of silicon.
 28. Thesystem of claim 16, wherein said pathway comprises a drain conduitseparating a first volume of said crucible device from a second volumeof said crucible device, and a plug device associated to control flow ofsaid generally molten quantity of silicon through said drain conduit forcontrollably positioning said plug device for controlling flow of saidgenerally molten quantity of silicon from said first volume to saidsecond volume, thereby disassociating at least a portion of saidgenerally molten quantity of silicon from said generally solidifiedquantity of silicon.
 29. The system of claim 26, wherein said secondvolume surrounds said first volume for flowing said at least a portionof said generally molten quantity of silicon into said second volumesurrounding said first volume.
 30. The system of claim 16, wherein saidtemperature control mechanism further for controls the temperature ofsaid silicon ingot by holding said silicon ingot at an elevatedtemperature following removal of said generally molten quantity ofsilicon for removing the stress-related structural defects in saidsilicon ingot, thereby enhancing silicon ingot quality.